Under Armour Unveils the UA SpeedForm Amp 2.0 at FW17 Fashion Show

At the Under Armour FW17 earlier this week, the brand quietly unveiled the UA SpeedForm Amp 2.0.

An update to the first Amp that got lackluster reviews due to the wide forefoot and narrow heel, the Amp 2.0 aims to improve with new tech.

An attempt to “unleash the power of your foundation” (your feet) the lightweight, durable, abrasion-resistant upper sits atop tooling that uses open, floating space between the foot and midsole. This should allow for natural arch movement, and coupled with the internal shank, should keep you pretty stable.

The tooling is straight EVA, no Charged here, and that makes sense. Additionally, there are strategic flex grooves for mobility and SpeedForm and an external TPU heel counter to keep you locked in. The burrito-style tongue is a welcome addition to the Amp 2.0. The SpeedForm sockliner is also moisture-wicking.

These should be arriving at retail in the coming months. They’re super lightweight in-hand. Hopefully, Duke4005 can grab a pair soon and bang the weights around in them (the louder you are in the weight room the more swole you get, #truefact).

Thoughts on the UA SpeedForm Amp 2.0? Sound off in the comments.

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